| 摘要 |
PURPOSE:To prevent the occurrence of an inferior product by picking up the image of a bonding chip at every bonding with a camera, and processing this image data with a chip detector thereby automatically detecting the positional misalignment and the angular misalignment of each bonding chip. CONSTITUTION:An image memory 8a takes in the image data of a bonding chip 1a picked up by a camera 9 on bonding side. A data processor 8b operates the position of the bonding chip 1a, based on this image data, and also operates the angle of the bonding chip 1a. The quantity of positional misalignment and the quantity of angular misalignment of a chip from the specified position and the specified angle by this operation result are compared with the maximum quantity of positional slippage of a chip and the maximum quantity of angular misalignment of a chip to the last bonding. And, depending upon whether the quantity of each misalignment of chip position and chip angle is within an allowable range or not, it is judged whether the bonding chip 1a is good or bad. |
