| 摘要 |
PURPOSE:To improve reliability on electrical connection regarding a crimp terminal maintaining electrical connection abutted against an opposite terminal with adhesives, a crimping method an the mounting method of a semiconductor device utilizing said crimp terminal. CONSTITUTION:Grooves 17a, 17b are formed on the top face of crimp terminals 6d, 6e abutted against opposite terminals, and conventional abutting surfaces are divided into a plurality of abutting surfaces 6b. Projecting sections formed by such grooves 17a, 17b are plastically deformed easily when the projecting section are abutted against the opposite terminals, and adhesives held by connecting sections are made to flow out easily. Consequently, when the contact- bonding terminals 6d, 6e are connected to the opposite terminals, the areas of connection are ensured readily, are reliability is improved. Adhesive-filling grooves are shaped on the top faces of the crimp terminals, no adhesive adheres on the abutting surfaces with the opposite terminals, and the crimp terminals are pushed at two stages and the increase of the diameters of adhesives is controlled, thus enhancing the reliability of a connecting section. |
