发明名称 |
JACK-TYPE IC PACKAGE |
摘要 |
The lead pins of a semiconductor IC is converter to a jack type so that manufacturing process becomes simple. The semi-conductor IC and lead pins are electrically connected by conduction wires (14-a) and the semiconductor IC and a jack housing which protects the connection pins is fixed by resin film. The jack housing is molded by the plastic resin (14). |
申请公布号 |
KR940005712(B1) |
申请公布日期 |
1994.06.23 |
申请号 |
KR19910020242 |
申请日期 |
1991.11.14 |
申请人 |
GOLDSTAR ELECTRON CO., LTD. |
发明人 |
BAEK, SUNG - DAE |
分类号 |
H01L23/28;H01L21/56;H01L23/31;H01L23/49;H01L23/498;H01L23/50 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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