发明名称 JACK-TYPE IC PACKAGE
摘要 The lead pins of a semiconductor IC is converter to a jack type so that manufacturing process becomes simple. The semi-conductor IC and lead pins are electrically connected by conduction wires (14-a) and the semiconductor IC and a jack housing which protects the connection pins is fixed by resin film. The jack housing is molded by the plastic resin (14).
申请公布号 KR940005712(B1) 申请公布日期 1994.06.23
申请号 KR19910020242 申请日期 1991.11.14
申请人 GOLDSTAR ELECTRON CO., LTD. 发明人 BAEK, SUNG - DAE
分类号 H01L23/28;H01L21/56;H01L23/31;H01L23/49;H01L23/498;H01L23/50 主分类号 H01L23/28
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