发明名称 COVER TAPE FOR SEALING THE CHIP-HOLDING PARTS OF A CARRIER TAPE
摘要 A cover tape (10) for sealing chips (4) in chip-holding parts (3) of a carrier tape (1) having said parts provided discontinuously and longitudinally of said carrier tape, which cover tape comprises a base tape (11), an adhesive layer (12) formed on one surface of said base tape and a non-adhesive coat (13) formed on said adhesive layer along the longitudinal direction of said base tape so that said non-adhesive coat has a width broader than that of the chips and narrower than that of said adhesive layer. When the cover tape is used in combination with the carrier tape, the chip-holding parts are sealed by the cover tape having the non-adhesive coat and in consequence the chips held in the chip-holding parts do not come in contact with the adhesive layer although they might come in contact with the non-adhesive coat. Accordingly, the chips are not stained by the adhesive in the adhesive layer.
申请公布号 KR940005806(B1) 申请公布日期 1994.06.23
申请号 KR19880009322 申请日期 1988.07.23
申请人 LINTEC CO., LTD. 发明人 ITOH, KAZUMI;ABE, KAZUYOSHI;MINAGAWA, TOSHIO
分类号 B65D73/02;B65D75/32;B65D75/34;H05K13/00;(IPC1-7):B65D73/02 主分类号 B65D73/02
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