发明名称 |
COVER TAPE FOR SEALING THE CHIP-HOLDING PARTS OF A CARRIER TAPE |
摘要 |
A cover tape (10) for sealing chips (4) in chip-holding parts (3) of a carrier tape (1) having said parts provided discontinuously and longitudinally of said carrier tape, which cover tape comprises a base tape (11), an adhesive layer (12) formed on one surface of said base tape and a non-adhesive coat (13) formed on said adhesive layer along the longitudinal direction of said base tape so that said non-adhesive coat has a width broader than that of the chips and narrower than that of said adhesive layer. When the cover tape is used in combination with the carrier tape, the chip-holding parts are sealed by the cover tape having the non-adhesive coat and in consequence the chips held in the chip-holding parts do not come in contact with the adhesive layer although they might come in contact with the non-adhesive coat. Accordingly, the chips are not stained by the adhesive in the adhesive layer. |
申请公布号 |
KR940005806(B1) |
申请公布日期 |
1994.06.23 |
申请号 |
KR19880009322 |
申请日期 |
1988.07.23 |
申请人 |
LINTEC CO., LTD. |
发明人 |
ITOH, KAZUMI;ABE, KAZUYOSHI;MINAGAWA, TOSHIO |
分类号 |
B65D73/02;B65D75/32;B65D75/34;H05K13/00;(IPC1-7):B65D73/02 |
主分类号 |
B65D73/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|