Hollow plastic molded package for semiconductor device and process for manufacturing same.

摘要

A plastic-molded-type hollow semiconductor device includes a base (2) and a cover (5), which are joined together by a thermosetting resin bonding material (9) that is applied to the entire edge surfaces of the cover (5) as well as bonding surfaces of the base (2) and the cover (5). The thermosetting resin bonding material (9) is applied after placing the cover (5) on the base (2) and simultaneously pre-heating them, whereby the inner gas trapped between the base (2) and the cover (5) is prevented from expanding, so that the generation of through-holes (8) is eliminated, thereby making it possible to obtain a semiconductor device which provides a high level of handling property and reliability.