| 摘要 |
PURPOSE:To provide a polishing process to automatically produce a polishing orbit through one and the same device and execute a polishing process. CONSTITUTION:A tool for measurement is attached to a device. The polishing region of a work is divided in the directions of two axes crossing each other at right angles at an effective radius unit of contact of a polishing tool with a work 3. A division line forms a polishing pattern and copying the polishing region along the pattern is effected at S1-S6. In this case, impedance control is effected so that a force detected by a dynamics sensor 4 is adjusted to a set value, and the position of a curve in an intersection position between the division lines and curve data are obtained at S7. A tool for polishing is attached and based on obtained data, a polishing route is decided and polishing operation is performed through impedance control at S8-S11. |
