| 摘要 |
A multi-chip module having a conformal heat transfer interface to adapt to variations in the height and angle of integrated circuit chips and to achieve a thermal energy path between each chip and a heat sink. The conformal heat transfer interface includes a deformable metallic membrane and a liquid under pressure. The liquid has a high thermal conductivity and provides a pressure for deforming the metallic membrane to compensate for non-coplanarity of the chips. The module integrates the structural support, RF shielding, contamination-protection elements, and the heat-dissipating mechanism that are desired in the design of multi-chip modules. Double-sided cooling of the module significantly improves the thermal characteristics of a module, even in the absence of the conformal heat transfer interface.
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