| 摘要 |
PURPOSE:To obtain a method of manufacturing an electronic device, in which a device in a complicated shape can be molded in a small package. CONSTITUTION:A resin mold type electronic device is manufactured by a method wherein a coil element 12 is arranged in the recess 11a of a first mold 11, having the recess 11a configured so that the upper surface and one side surface are opened, so that the side surface 14a of the coil element 12 is extended from the side surface 11b of the mold 11, then, the coil element 12 is pushed by the side surface 17c of a second mold 17 to position the coil element 12 in a space constituted of the second mold 17 and the recess 11a and, thereafter, resin is poured into the space 20 to mold a resin mold layer. |
