发明名称 PRODUCTION OF SINGLE SURFACE COPPER CLAD LAMINATED SHEET
摘要 <p>PURPOSE:To reduce the generation of warpage due to heating at the time of processing by setting the heat shrinkage factor after heating and pressing in a copper foil layer to a specific ratio with respect to that of the layer opposite to the copper foil layer in the constitution of a prepreg. CONSTITUTION:In the production of a single surface copper clad laminated sheet, the constitution of a prepreg is set so that the heat shrinkage factor after heating and pressing of a copper foil layer is set to 25-75%, pref., 30-70% with respect to that of the layer opposite to the copper foil layer. The heat shrinkage factor is a value calculated from dimensions before and after heating when a laminate with a thickness of 1.6mm obtained by heating and pressing eight superposed prepregs of the same kind is heated to 150 deg.C at a speed of 5 deg.C/min and subsequently naturally cooled according to a prescribed formula.</p>
申请公布号 JPH06171017(A) 申请公布日期 1994.06.21
申请号 JP19920328209 申请日期 1992.12.08
申请人 HITACHI CHEM CO LTD 发明人 SAKAI KAZUNAGA;NAKAMURA YOSHIHIRO
分类号 B32B37/00;B29K105/06;B32B15/08;C08J5/24;H05K1/03;(IPC1-7):B32B15/08;B29D9/00 主分类号 B32B37/00
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