发明名称 Photo-mask for use in manufacturing printed wiring boards
摘要 An original for use in manufacturing printed circuit boards comprising a film base 1, an image pattern 2, and a protective film 3 for protecting the pattern, and a release layer 4 preferably of a silicone resin or a fluorine-containing resin. The release layer 4 when applied to a photosensitive resist surface prevents sticking at the time of exposure of the photosensitive resin or damage of the photosensitive resin surface or the pattern surface of the original. <IMAGE>
申请公布号 GB2249196(B) 申请公布日期 1994.06.15
申请号 GB19910019712 申请日期 1991.09.16
申请人 * NIPPON CMK CORP. 发明人 SHIN * KAWAKAMI;SATOSHI * HARUYAMA
分类号 G03F7/11;G03F1/00;G03F1/14;H05K3/00;(IPC1-7):G03F1/14 主分类号 G03F7/11
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