SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PURPOSE:To provide a chip carrier type semiconductor integrated circuit device which enhances connection reliability between a semiconductor chip and a package board. CONSTITUTION:A cap 6 which seals a semiconductor chip 5 is made of metal or synthetic resin and designed to absorb a tensile stress which applies to a soldering bump 4 produced by differential thermal expansion coefficients of the semiconductor chip 5, a package board 2 and the cap 6 by deforming the shape of the cap 6.