发明名称 Gas flow distribution system for molten solder dispensing process
摘要 A gas flow distribution system for a solder dispensing head includes a base member adapted to be connected to the solder dispensing head and a structure connected to a source of an inert gas for distributing at least one continuous stream of the inert gas radially and axially below the solder dispensing head to exclude oxygen in the surrounding air therefrom.
申请公布号 US5320273(A) 申请公布日期 1994.06.14
申请号 US19930100833 申请日期 1993.08.02
申请人 FORD MOTOR COMPANY 发明人 GOENKA, LAKHI N.;JAIRAZBHOY, VIVEK A.
分类号 B23K3/08;H05K3/34;(IPC1-7):B23K3/06 主分类号 B23K3/08
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