COMPOUND SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PURPOSE:To prevent the breakage of chips and the frequency of defective appearances to a minimum in a blade dicing process in terms of an electric power GaAsFET or monolithic microwave integrated circuit and to provide a high quality compound semiconductor device which prevents the separation of a CVD film or a pad in a less visual inspection time. CONSTITUTION:There is provided a groove 1 inside a dicing line 5 in the vertical direction to an orientation flat where a CVD film 3 or a chip pattern is installed separated from the groove 1.