| 摘要 |
PURPOSE: To reinforce adhesive force between an insulating layer and respectively of a lead frame, a package body and a semiconductor chip or adhesive force between the lead frame and the package body by forming unevenly a contact face between an insulating layer and an inner lead and a contact face between the insulating layer and the package body. CONSTITUTION: The contact face between an insulating layer 53 and an inner lead 54b of a lead frame 54 and the contact face between the layer 53 and a package body 56 are ruggedly formed. Also a contact face between a semiconductor chip 51 and the layer 53 is formed unevenly. In addition, a contact face between the inner lead 54b and the package body 56 is formed unevenly. Namely, fine projections 57 are formed on the surface of the chip 51 and uneven faces are formed on the upper and lower faces of the layer 53 and the inner lead 54b of the frame 54 and these members are stucked to each other. Consequently, adhesive forces between the chip 51 and the layer 53, between the layer 53 and the inner lead 54b and between the lead 54b and the package body 56 can be improved. |
