发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve heat-dissipating properties as the whole device, and to enhance reliability by preventing the narrowing of a space between an island and a heat spreader and excellent filling a section between both island and heat spreader with a sealing material. CONSTITUTION:Dimples 11c, 11d are formed to both surfaces of a heat spreader 11, and the dimple 11c of one surface is displaced and arranged at every half pitch to the dimple 11d of the other surface.
申请公布号 JPH06163750(A) 申请公布日期 1994.06.10
申请号 JP19920318499 申请日期 1992.11.27
申请人 MITSUBISHI ELECTRIC CORP 发明人 HIRAI TATSUYA;HIGUCHI TOKUMASA
分类号 H01L23/28;H01L23/29;(IPC1-7):H01L23/29 主分类号 H01L23/28
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