| 摘要 |
PURPOSE:To provide a multilayer interconnection board having no bad effect on an electric signal transmitted through a metalized layer or a circuit wiring thin film, by connecting the metalized wiring layer on an insulating board surely with the thin-film wiring part. CONSTITUTION:A multilayer interconnection board comprises an insulating base body having a metalized wiring layer 5 with a connection pad 5a, and a thin-film wiring part made up of a circuit wiring film 3 alternately deposited with a high-polymer insulating film 2 that covers the insulating base body. The connection pad 5a of the metalized wiring layer and the circuit wiring film 3 of the thin-film wiring part are connected through each through holes 6 formed in the insulating film 2. The plurality of through holes 6, used for connecting the connection pad 5a of the metalized wiring layer and the circuit wiring film 3 of the thin-film wiring part, are formed widely in an area (B) two to one hundred times as large as a total area (A) of the connection pad 5a. |
