| 摘要 |
PURPOSE:To facilitate replacing an faulty semiconductor chip with a good semiconductor by cutting the wire at the root connected to the electrode of a substrate, and heating resin, and breaking the adhesion between the semiconductor chip and the substrate. CONSTITUTION:A wire 15 connected to the electrode 12 of a substrate is cut at the root, using a wire cutting tool 17. Next, temperature of resin 13 for die-bonding is raised from the side of the substrate 11 by heating a heating stage 19 or a chip removing tool 18, whereby adhesive strength between the substrate 11 and a semiconductor chip 14 drops. Next, a chip is exfoliated from the substrate 11 by applying load to the side of the side face of the semiconductor chip 14 with a chip removing tool 18, and applying horizontal force to the rear of the chip. At this time, the wire 15 is removed together with the semiconductor chip 14, as it is connected to the semiconductor chip 16. Hereby, the cut wire hardly remains on the side of the substrate electrode. |
