PRODUCTION OF COPPER-CLAD POLYIMIDE FILM

摘要

PURPOSE:To produce a copper clad polyimide film having higher adhesion when a polyimide film with a formed copper film is produced by thermally decomposing copper formate. CONSTITUTION:A film of polyimide obtd. by condensing biphenylcarboxylic acid or a deriv. thereof with an arom. diamine is allowed to coexist with copper formate and this copper formate is thermally decomposed under reduced pressure or in a nonoxidizing atmosphere to produce a polyimide film with a formed copper film. This polyimide film is then heat-treated in a nonoxidizing atmosphere under the conditions of 150-<250 deg.C treatment temp. (T) and >=50min treatment time (H) satisfying an inequality 580-2T