发明名称 RUBBER MOLDING DIE
摘要 PURPOSE:To improve corrosion resistance and mold release property of a die with respect to rubber by layering in sequence Ni film, NiP film, and NiSn film at a part with which rubber in a rubber molding die comes in contact. CONSTITUTION:On a metal surface from which oxide film is removed, an Ni film having a thickness of 1-10mum is formed by ordinary electric plating. For a second layer, an NiP film of 1mum or above is formed by electroless plating. For a third layer, an NiSn film having excellent corrosion resistance and mold release property with a thickness of 1-50mum is formed by the electric plating. Thereafter, it is treated with heat for raising the hardness. In this die, the whole film holds a high adhesion to a parent material by the Ni film, the NiP film heightens the adhesion to the Ni film and holds the hardness of the NiSn film of the third layer.
申请公布号 JPH06155479(A) 申请公布日期 1994.06.03
申请号 JP19920313808 申请日期 1992.11.24
申请人 SHOWA DENKO KK 发明人 KASHIWADA KUNIO;KODAMA TAKANORI;NAKAMURA HIROSHI
分类号 B29C33/38;B29K21/00;C23C18/52;(IPC1-7):B29C33/38 主分类号 B29C33/38
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