SURFACE MOUNT MICROCIRCUIT HYBRID

摘要

A surface-mountable packageless hybrid (20) comprising a ceramic substrate (24) with circuit elements (26) attached to a top surface (27) of the substrate is attached to a ground pad (30) on a printed circuit board (34). A high performance transition for microwave frequency signals between the circuit board and the substrate is provided by RF connections (38) comprising three gull wing shaped leads (42-44) connecting three solder pads (46-48) on the printed circuit board to three solder pads (50-52) on the substrate, the solder pads having capacitive matching sections to compensate for lead inductance. The center lead (43) conducts the microwave frequency signal while the outer leads (42,44) are grounded.