发明名称 |
Gehäuse aus Metall und Kunststoff für eine Halbleiter-Vorrichtung, das zur Befestigung an einem nicht genau ebenen Wärmeableiter geeignet ist, sowie Verfahren zu dessen Herstellung |
摘要 |
A semiconductor component package comprises a metal plate and a synthetic resin housing or body. The plate is formed with an aperture by which it can be secured to a heat sink, generally a metal plate. Around the aperture is a weakened annular portion produced by shearing. When the package housing is secured to a surface which is not completely flat, mechanical stressing due to the tightening of the screw coupling is limited to the weakened annular portion and is not transmitted to the resin housing and to the elements therein. |
申请公布号 |
DE3438435(C2) |
申请公布日期 |
1994.06.01 |
申请号 |
DE19843438435 |
申请日期 |
1984.10.19 |
申请人 |
SGS-ATES COMPONENTI ELETTRONICI S.P.A., AGRATE BRIANZA, MAILAND/MILANO |
发明人 |
ROMANO', LUIGI, MONZA, MAILAND/MILANO |
分类号 |
H01L23/32;H01L23/28;H01L23/40;H01L23/495;(IPC1-7):H01L23/12;H01L21/48;B21D22/04 |
主分类号 |
H01L23/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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