Halbleitersubstrat-Ätzgerät.

摘要

A semiconductor substrate etching apparatus for etching a tapered outer circumferential surface of a semiconductor substrate. A semiconductor substrate supply unit (22), an X-Y stage unit (23), an etchant applying unit (24), a cleaning unit (25), a baking unit (26), and a semiconductor substrate recovering unit (27) are arranged in a horizontal plane in the described order. Semiconductor substrates (1) are sequentially transferred by a transfer mechanism from the semiconductor substrate supply unit (22) to the semiconductor substrate recovering unit (27) in the described order. A control unit (55) controls the transfer mechanism to perform the transferring of the semiconductor substrate (1), and controls the X-Y stage unit (23) in response to a position detection signal, outputted from a position detector (23b), for positioning the semiconductor substrate (1) on the X-Y-stage unit (23).