| 摘要 |
PURPOSE:To remarkably improve the manufacturing yield and reliability of a resin sealed semiconductor device by remarkably improving the adhesibility between a lead frame and sealing resin. CONSTITUTION:Firstly, Ni-plated films 1 having thicknesses of 2mum are respectively formed on the surface of a copper plate 2 to which a semiconductor chip 5 is to be stuck and the other surface of the plate 2 by performing Ni- plating on the surfaces and a lead frame A, on the side face of which the surface 3 of the copper plate 2 is exposed and which has a prescribed shape, is formed by press-working the plated copper plate 2. Then, after die bonding the semiconductor chip 5 to the frame A by using solder 4 of lead and tin, copper oxide 3a is formed on the side face of the frame A by oxidization. Thereafter, outer leads 7 are connected to the chip 5 through aluminum wires 6 and an epoxy resin is molded as a sealing resin 8. |
