OPTICAL SEMICONDUCTOR DEVICE

摘要

PURPOSE:To realize the moistureproofing of transparent resin and to prevent resin cracks and the like by coating the surface of the transparent resin for protection with moistureproofing resin. CONSTITUTION:Injection molding is performed so to form a recess part 22 in a resin substrate 21. Wirings 23a ad 24a and terminals 23b and 24b are provided at the specified parts of the resin substrate 21 and the recess part 22 by solid plating. An optical element 25 is die-bonded and mounted on the wiring 23a at the recess part 22. The optical element 25 and the wiring 24a are wired with an Au wire 28. Then, transparent resin 26 is filled and sealing is performed. The surface is further coated with moisture proofing resin 27. Thus the intrusion of water into the interface between the transparent resin 26 and the resin substrate 21 and the optical element 25 is avoided. Therefore moistureproofing properties are improved. Troubles such as interface peeling of the transparent resin 26 and the optical element caused by steam explosion in reflow soldering and the deterioration of output caused by the cracks in the transparent resin 26 can be prevented.