发明名称 |
LEAD FRAME AND SEMICONDUCTOR DEVICE USING SAME |
摘要 |
In a lead frame adapted to be used for a semiconductor device, a plurality of inner leads (18) are made of a thin conductive material for easily forming a fine pattern of the inner leads. A plurality of outer leads (20) are integrally formed with the respective inner leads. The outer leads are coated with metal layers to increase the thickness thereof, so that a desired strength of the outer leads is obtained. A semiconductor chip (24) is electrically connected to the inner leads. The semiconductor chip and a part of the lead frame including the inner leads are hermetically sealed with a resin (26) and, thus, a semiconductor device is obtained. |
申请公布号 |
WO9411902(A1) |
申请公布日期 |
1994.05.26 |
申请号 |
WO1993JP01677 |
申请日期 |
1993.11.16 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD.;KURAISHI, FUMIO;YUMOTO, KAZUHITO;HAYASHI, MAMORU |
发明人 |
KURAISHI, FUMIO;YUMOTO, KAZUHITO;HAYASHI, MAMORU |
分类号 |
H01L21/60;H01L21/48;H01L23/24;H01L23/433;H01L23/495;H01L23/50 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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