SEMICONDUCTOR DEVICE HAVING A PLURALITY OF CHIPS

摘要

A semiconductor device which has a first main surface and a second main surface opposed to each other, a lead frame (21) that can be bonded on its first and second main surfaces, a first semiconductor chip (22) arranged on the first main surface of said lead frame, first tape leads (23) that electrically connects the first main surface of said lead frame to said first semiconductor chip, a second semiconductor chip (24) arranged on the second main surface of said lead frame, and second tape leads (25) that electrically connects the second main surface of said lead frame to said second semiconductor chip.