发明名称 Ceramic semiconductor package having crack arrestor patterns.
摘要 <p>A ceramic semiconductor package wherein metal crack arrestor patterns (48) are formed in the corners of the package thereby increasing the strength of the package and acting as a barrier to microcracks. The metal crack arrestor patterns (48) may be electrically and physically isolated from metal interconnect (42) lines in the package and also may be formed using the same processing steps that are used to form the metal interconnect lines (42).</p>
申请公布号 EP0351602(B1) 申请公布日期 1994.05.25
申请号 EP19890111822 申请日期 1989.06.29
申请人 MOTOROLA, INC. 发明人 BLUMENSHINE, KENT M.;MARCUS, HARRIS L.;LONG-DAUGHERTY, KATHLEEN A.
分类号 H01L23/13;H01L23/00;H01L23/12;H01L23/498;H05K1/02;H05K1/03;(IPC1-7):H01L23/00 主分类号 H01L23/13
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