发明名称 RESIN MOLD AND CONTROLLING METHOD FOR TEMPERATURE THEREOF
摘要 PURPOSE:To control cast resin to a temperature suitable for molding even without increasing a thickness of a mold body and to mold an excellent cast product with small shrink and residual stress. CONSTITUTION:When epoxy resin is cast, heat of oil 18 of a high temperature side is transferred to a mold body 11 via heat pipes 15, 16, and the body 11 is heated to the vicinity of an optimum curing temperature of the resin. When the resin generates heat upon curing, the body 11 becomes high temperature, and hence heat of the body 11 is transferred to the oil 18 via the pipes 15, 16 to cool the body 11, and the body 11 is maintained near the optimum curing temperature.
申请公布号 JPH06143289(A) 申请公布日期 1994.05.24
申请号 JP19920298374 申请日期 1992.11.09
申请人 TOSHIBA CORP 发明人 MAEDA TERUHIKO;ITO YOSHIHIRO;ABE KEIICHI;OZAKI KAZUFUMI;KURACHI YOSHIKAZU
分类号 B29C33/02;B29C39/26;B29K63/00;B29L31/34;(IPC1-7):B29C33/02 主分类号 B29C33/02
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