CONDUCTIVE LAMINATED FILM

摘要

PURPOSE:To enhance the bonding strength of a BPDA type polyimide film base material and a metal film. CONSTITUTION:A substrate layer (thickness, 10-100Angstrom ) composed of chromium, silver or palladium is formed between a BPDA type polyimide film base material and a conductive layer and the bonding surface with the substrate layer of the film base material is roughened so that the Ra value thereof becomes 0.02-0.1mum and a fluorinated polyimide layer is formed on the rough surface of the film base material and the film base material is bonded to the substrate layer through this fluorinated layer.