首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
ELECTRONIC COMPONENT PACKAGE FOR SURFACE MOUNTING
摘要
申请公布号
JPH06140775(A)
申请公布日期
1994.05.20
申请号
JP19920309631
申请日期
1992.10.23
申请人
MURATA MFG CO LTD
发明人
KOIKE JUN
分类号
H05K5/06;(IPC1-7):H05K5/06
主分类号
H05K5/06
代理机构
代理人
主权项
地址
您可能感兴趣的专利
GRAIN COARSENING-RESISTANT CASE HARDENING STEEL, SURFACE HARDENED PARTS EXCELLENT IN STRENGTH AND TOUGHNESS AND PRODUCTION THEREOF
SEMICONDUCTOR ELEMENT AND ITS MANUFACTURE
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND ITS MANUFACTURE
MANUFACTURE OF SEMICONDUCTOR DEVICE
IMAGE FORMING DEVICE AND IMAGE FORMING METHOD
MASK ROM CELL AND ITS MANUFACTURE
INSPECTING EQUIPMENT OF SEMICONDUCTOR PACKAGE
WIRE-BONDING METHOD AND DEVICE
CARD AND CARD PROCESSING METHOD
NON-CONTACT TYPE IC CARD
DISCHARGE LAMP LIGHTING DEVICE
LAMINATED OPENING PLANE ANTENNA AND MULTILAYER CIRCUIT BOARD EQUIPPED WITH IT
AUTOMATIC TICKET ISSUING MACHINE
PORTABLE TELEPHONE SET WITH CODE READER
PRODUCTION PROCESS OF ALIPHATIC DIOL
PRODUCTION OF LINEAR ORGANOHYDROGENSILOXANE OLIGOMER
OPTICAL TRANSMITTER AND OPTICAL TRANSMISSION SYSTEM USING IT
OPTICAL PATH SWITCHING MONITORING SYSTEM AND MONITORING METHOD
LIGHT EMITTING ELEMENT MODULE AND MOUNTING METHOD THEREOF
OPTICAL COMMUNICATIONS NETWORK NODE
