| 摘要 |
The present invention relates to a capacitive microsensor comprising a sandwich of three silicon wafers (1, 2, 3), each face of a region, in the form of a frame (31), of the central wafer being adhesively bonded to the opposite face of each external wafer by means of a thin layer forming an insulating strip (5, 6), at least one of the external wafers constituting a first electrode (22, 23), and at least one central part of this central wafer forming a capacitor of variable capacitance with at least one of the external wafers. The region, in the form of a frame, of the central wafer is electrically separated from the said central part. First contacts (26) are integral with the part in the form of a frame, and second contacts (21) are connected to the central part and constitute a second electrode of the capacitor with variable capacitance. <IMAGE> |
