发明名称 |
Verfahren zur Behandlung von Substraten aus Polyetherimid und daraus hergestellte Artikel. |
摘要 |
<p>The method is provided for treating the surface of a polyetherimide substrate to improve its adhesion characteristics for electrolessly deposited metal, such as copper. There is employed a series of surface treatments including the initial immersion of the polyetherimide substrate in sulfuric acid, contact with aqueous base, such as potassium hydroxide, followed by oxidation with an alkali metal permanganate such as potassium permanganate, and surface treatment with a reducing agent, such as a hydroxylamine salt. Polyetherimide metal composites are also provided.</p> |
申请公布号 |
DE69003981(T2) |
申请公布日期 |
1994.05.19 |
申请号 |
DE1990603981T |
申请日期 |
1990.03.26 |
申请人 |
GENERAL ELECTRIC CO., SCHENECTADY, N.Y. |
发明人 |
FOUST, DONALD FRANKLIN, SCOTIA, NEW YORK 12302;DUMAS, WILLIAM VINCENT, DELANSON, NEW YORK 12053 |
分类号 |
B32B15/088;C08J7/12;C23C18/20;C23C18/24;C23C18/28;H05K3/38;(IPC1-7):C23C18/24 |
主分类号 |
B32B15/088 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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