发明名称 |
METHOD OF PRODUCING TREATED COPPER FOIL, PRODUCTS THEREOF AND ELECTROLYTE USEFUL IN SUCH METHOD |
摘要 |
An improved treatment for copper foil comprising electrodepositing a metallic barrier layer of copper, zinc and antimony on at least one side of the foil which, preferably, has a matte surface formed prior to forming the barrier layer. The so-treated foil provides a high bonding strength when laminated to polymeric substrates and resists undercutting by mineral acid etchants and rinses during production of printed circuit boards. |
申请公布号 |
EP0495468(A3) |
申请公布日期 |
1994.05.18 |
申请号 |
EP19920100538 |
申请日期 |
1992.01.14 |
申请人 |
CIRCUIT FOIL U.S.A. INCORPORATED |
发明人 |
WOLSKI, ADAM M.;MAQUET, LAURETTE M.;STREEL, MICHEL |
分类号 |
C25D3/58;H05K3/38 |
主分类号 |
C25D3/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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