| 摘要 |
PCT No. PCT/JP91/00786 Sec. 371 Date Apr. 21, 1992 Sec. 102(e) Date Apr. 21, 1992 PCT Filed Jun. 11, 1991 PCT Pub. No. WO92/00603 PCT Pub. Date Jan. 9, 1992.Actualized are fingers through which a semiconductor integrated circuit including high density electrode strings can be easily safely mounted on a circuit substrate in the same manner with the prior art. A conductor pattern capable of improving a packaging density of the integrated circuit including the fingers is actualized. The fingers are therefore configured using the multi-layered conductor pattern. The conductor pattern is multi-layered, i.e., consists of conductive layers and an insulating layer for separating these conductive layers. In addition to a wiring pattern serving as fingers for connecting an integrated circuit to a packaging substrate, an electrification path for interlayer connections is also formed in a thickness direction. The circuit substrate exhibiting a high packaging density can be actualized.
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