发明名称 MOLDING RESIN MAGAZINE FOR SEMICONDUCTOR MOLDING DEVICE
摘要 PURPOSE:To prevent deterioration in the quality of products by providing discharge ports for discharging air into a molding resin containing chamber of a resin-molded magazine and a recovery port for recovering the discharged air, dehumidifying moisture of molding resins and removing resin powder from the same with the aid of this air. CONSTITUTION:Molding resins 15 are aligned and loaded in a case 1b of a resin-molded magazine, and their falling is prevented by closing a stopper 2. A clear air feed port 8a and an exhaust port 8b are provided on a magazine mounting plate 8, and air introduced through the feed port 8a is discharged from a discharge port 1d provided orthogonally to a feed hole 1b and further from discharge ports 1f, 1g through a vertical hole 1e. Moisture in the molding resins 15 is absorbed to the discharged air, and attached resin powder is blown off downward by this air and discharged outside the case from a recovery hole 1h orthogonal to an exhaust hole 1c through the exhaust port 8b. The molding resins 15 dehumidified and dust-removed are supplied to a semiconductor molding device by opening the stopper 2, whereby deterioration in the quality of products can be prevented.
申请公布号 JPH06134793(A) 申请公布日期 1994.05.17
申请号 JP19920284268 申请日期 1992.10.22
申请人 TOSHIBA CORP 发明人 TSUJI TOSHIAKI
分类号 B29B13/00;B29C45/02;B29C45/17;B29C45/18;B29L31/34;B65D85/50;H01L21/56;(IPC1-7):B29C45/02 主分类号 B29B13/00
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