发明名称 METHOD FOR MOLDING SYNTHETIC RESIN MOLDED FORM USING HOLLOW STRUCTURE PLATE
摘要 PURPOSE:To mold a molded form having substantially uniform thickness, a high strength and beautiful both sides by setting a heated hollow structure plate, mold clamping vacuum molds, holding the plate between both molding surfaces, and evacuating both vacuum molds to suck by vacuum the plates to both molding surfaces. CONSTITUTION:A pair of liners 32, 33 disposed in parallel, and many ribs 34 for partitioning between the liners 32 and 33 in parallel in a longitudinal direction are provided. The liners 32, 33 use a hollow structure plate 31 molded by integrally extruding synthetic resin material such as olefin base resin, ABS resin, etc., and two vacuum molds 10, 20 opposed at an interval substantially equal to a thickness of the plate 31 at two molding surfaces at the time of mold clamping. The heated plate 31 is set between the opened molds 10 and 20. Then, the molds 10, 20 are clamped, the plate 31 is held between both the molding surfaces, the molds 10, 20 are evacuated to vacuum suck the plate 31 between both the molding surfaces.
申请公布号 JPH06134852(A) 申请公布日期 1994.05.17
申请号 JP19930201127 申请日期 1993.07.20
申请人 KONAN TOKUSHU SANGYO KK;UBE NITTO KASEI CO LTD 发明人 OYAMA KANJI;FUKUSHIMA KATSUHIKO
分类号 B29C51/10;B29C51/36;B29L22/00;B29L31/58;(IPC1-7):B29C51/10 主分类号 B29C51/10
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