| 摘要 |
PURPOSE:To prevent the deformation and the like of a lead frame in the transfer molding of a semiconductor device without requiring a special device for cutting off of the remainder of runner resin. CONSTITUTION:A lead frame 21, on which a semiconductor element 20 is mounted, is pinched between the upper mold 1', having cavities 2 and 3 for filling, and the lower mold 1. A part of the lower mold 1, provided with a runner 6, is constituted as a runner block 9 which works independently in the direction of mold releasing, a mold releasing ejector pin 10 is provided in the runner block 9, a lead frame supporting pin 11 is provided in the vicinity of the runner 6, and also a mold releasing ejector pin 10' is provided on the upper mold 1' corresponding to the runner 6. After a resin molding part 22 has been molded, the mold releasing ejector pin 10' is protruded in the state wherein the lead frame 21 is retained by the lead frame supporting pin 11, the runner block 9 is operated in the mold releasing direction, and the remainder of runner resin 24a is cut off from the resin molding part 22 and the lead frame 21. |
