| 摘要 |
<p>PURPOSE:To disperse a pressure applied onto a wafer when it is fixed so as to protect it against crack, chipping, and warpage by a method wherein the semiconductor wafers housed in a container are held by a dust-proof elastic body. CONSTITUTION:After a required number of semiconductor wafers 4 are housed in a container 1, an elastic presser is placed on the semiconductor wafers 4 so as to make its curved part come into contact with them. Then, a lid 2 is fitted in the container 1, and the semiconductor wafers l are housed and fixed in the semiconductor wafer container 1. As the elastic presser is formed separate from the lid 2, various types of elastic body can be used corresponding to the housed semiconductor wafers 4. By this setup, a semiconductor wafer container applicable to semiconductor wafers 4 various in thickness can be obtained.</p> |
