发明名称 FABRICATION OF SEMICONDUCTOR MEMORY DEVICE
摘要 PURPOSE:To improve data retaining characteristics by making a trench contiguous to one source-drain region of a MOS transistor in a semiconductor substrate and forming a second lower electrode covering the inner face of the trench and a first lower electrode thereby preventing formation of a scooped part susceptible to field concentration. CONSTITUTION:A P<+> impurity layer 32 is formed surrounding the inner face of a trench 21. A poly-Si film 24 is then formed on the entire surface including the inner face of the trench 21 by CVD and phosphorus is diffused into the poly-Si film 24. The poly-Si film 24 is then patterned to cover a poly-Si film 31. The poly-Si film 24 contacts an impurity layer 15 on the side face of the trench 21 and also contacts with the poly-Si film 31 thus forming a second lower electrode of a capacitor 27. The contact part eliminates the need of planar region and reduces the memory area thus facilitating fabrication of high density, high integration semiconductor memory device.
申请公布号 JPH06132495(A) 申请公布日期 1994.05.13
申请号 JP19920301731 申请日期 1992.10.14
申请人 NIPPON STEEL CORP 发明人 ANZAI KENJI
分类号 H01L27/04;H01L21/822;H01L21/8242;H01L27/10;H01L27/108 主分类号 H01L27/04
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