发明名称 PHENOLIC RESIN MOLDING MATERIAL
摘要 PURPOSE:To provide a molding material excellent in moisture resistance, appearance and the packability in its injection molding, comprising each specific phenolic resin, laminate powder and plywood abrasive powder at specified proportion. CONSTITUTION:The molding material comprising (A) 100 pts.wt., on a phenolic resin basis, of an organic filler <=0.2mm in particle diameter prepared by simultaneous grinding phenolic resin and hexamethylenetetramine, (B) 10-60 pts.wt. of laminate powder <=0.2mm in particle diameter prepared by grinding laminates based on plant fibers such as kraft paper, cotton paper or linter paper with a resin content of 30-70wt.%, and (C) 10-60 pts.wt. of powder <=0.2mm in particle diameter prepared by sieving plywood abrasive powder.
申请公布号 JPH06128455(A) 申请公布日期 1994.05.10
申请号 JP19920280245 申请日期 1992.10.19
申请人 SUMITOMO BAKELITE CO LTD 发明人 YAMADA MASAE;FUJIMURA NOBUHISA
分类号 C08K5/3495;C08K9/04;C08L61/00;C08L61/04;C08L61/06;C08L97/00;(IPC1-7):C08L61/00;C08K5/349 主分类号 C08K5/3495
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