Low profile integrated heat sink and fan assembly

摘要

A low profile integrated assembly for dissipating heat from an electronic component includes a heat sink having a peripheral envelope, and a self-contained motorized fan unit for generating a flow of air being embedded substantially within the envelope of the heat sink. The heat sink includes a generally flat heat transferring bottom base plate and a multiplicity of elongated heat dissipating fins attached on and extending upwardly from the bottom base plate. The multiplicity of heat dissipating fins define a cavity. The fins include at least a pair of outer fins being spaced from one another and disposed along a pair of opposite sides of the base plate so as to define a pair of opposite sides of the cavity. The fins also include a plurality of inner fins disposed between the pair of spaced outer fins so as to define a bottom of the cavity being spaced above the base plate. The fan unit is disposed in the cavity and spaced above the base plate by being seated upon the inner fins and retained between the outer fins in a tight-fitting engaged relation therewith.