| 摘要 |
<p>Spin coating of resist on a semiconductor wafer is done in a controlled chamber, starting with introducing a resist solvent vapor into the chamber from a nozzle, applying the resist by spraying a very thin layer of the resist material, monitoring and adjusting the resist thickness during spinning in vapor, and then removing solvent from the chamber. The result is a saving in resist material and enhanced coating uniformity. <IMAGE></p> |
