发明名称 |
Cure inhibited epoxy resin compositions and laminates prepared from the compositions |
摘要 |
In summary, the invention is related to the discovery of a class of compounds which inhibits the reaction of a polyepoxide with a curing agent at low temperatures. More particularly the invention relates to an epoxy resin composition comprising a) a polyepoxide; and b) a cure inhibitor comprising boric acid or maleic acid. In another embodiment, the invention comprises an epoxy resin composition comprising a) a polyepoxide; b) a cure inhibitor comprising boric acid or maleic acid, c) a curing agent without phenolic hydroxyl moieties, and d) optionally a catalyst for the reaction of the polyepoxide with the curing agent. In still another embodiment the invention relates to a composition useful for curing a polyepoxide which comprises a) a curing agent capable of reacting with a polyepoxide at elevated temperatures; and b) an inhibiting amount of boric acid or maleic acid; and optionally c) a catalytic amount of a catalyst useful for accelerating the reaction of a polyepoxide with the curing agent.
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申请公布号 |
US5308895(A) |
申请公布日期 |
1994.05.03 |
申请号 |
US19920848499 |
申请日期 |
1992.03.06 |
申请人 |
THE DOW CHEMICAL COMPANY |
发明人 |
GAN, JOSEPH;BERTRAM, JAMES L. |
分类号 |
C08G59/18;C08G59/40;C08G59/50;C08J3/24;C08J5/24;(IPC1-7):C08K3/38;C08L63/00 |
主分类号 |
C08G59/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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