| 摘要 |
<p>PURPOSE:To obtain a semiconductor device enabling prevention of a fissure or peeling of a passive component and an improvement in reliability thereof, by relaxing a stress acting on a lead frame when a tie bar part of the lead frame is cut. CONSTITUTION:A transistor element 2 and a semiconductor element 3 are die- bonded on a transistor mounting part 1a and a semiconductor element mounting part 1b of a lead frame 1 respectively and wire-bonded to desired inner leads 1c by gold wires 7. A chip resistor 5 is connected between desired inner leads 1c with solder 6, while a groove 9 is provided in a part on the outer lead 1d side from a mounting part of the chip resistor 5 of the inner leads 1c. Molding is made with sealing resin in this state and thereafter a tie bar part is cut.</p> |
