发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To obtain an external lead out electrode in which intrusion of moisture, causing corrosion of electrode, is blocked. CONSTITUTION:An opening having diameter, smaller than that of the bonding ball 11 of an external lead out wire to be bonded, is made in a CVD nitride film 4 covering a lower layer lead out electrode 6. A buffer metal film 7 having diameter larger than that of the bonding ball 11 is then formed covering the opening and the CVD nitride film 4 thereabout thus producing an external lead out electrode having double structure of the lower layer lead out electrode 6 and the buffer metal film 7 where the CVD nitride film 4 is sandwiched on the peripheral part except the central part. Since the exposed surface of the buffer metal film 7 is not damaged by etching, intrusion of moisture is blocked and since the creeping route of moisture between the buffer metal film 7 and the lower layer external lead out electrode connected therewith in the central part is long, moisture resistance is enhanced significantly. oboe.
申请公布号 JPH06120289(A) 申请公布日期 1994.04.28
申请号 JP19920264463 申请日期 1992.10.02
申请人 NEC CORP 发明人 SATO NOBORU
分类号 H01L21/60 主分类号 H01L21/60
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