| 摘要 |
PURPOSE:To perform various kinds of marking simultaneously with mold without exchanging dies. CONSTITUTION:A pair of mold dies for forming the package of a semiconductor device by resin-molding are provided, in the upper die 1 out of the mold dies, with a marking part 3 equipped with many mark pins 3a, which are caused to protrude or retreat in the manner of corresponding to the contents of indication such as name, date of manufacture, etc., so that the stamp of a protruding or groove-shaped character, etc., can be formed simultaneously with mold. |
