| 摘要 |
PURPOSE:To obtain a resin sheathing structure which is able to withstand an inner pressure produced inside at a solder tank dipping test (JIS-C5102) executed at a specific temperature when an electric double-layer capacitor sealed up with molding resin is lessened in size and resin thickness. CONSTITUTION:A positive electrode plate and a negative electrode plate are provided sandwiching an element laminate 5 between them, hooks 6 formed in strips are provided to the sides of the electrode plates respectively not to come into contact with each other and bent at points by an angle of 90 deg. not to come into contact with the lead terminal of the opposite electrode respectively, and the element laminate 5 is clamped by the hooks 6. By this setup, a sheathing resin 7 is prevented from decreasing in strength when it is lessened in thickness, so that the sheathing resin 7 is prevented from being broken, withstanding an inner pressure produced inside at a solder dipping test (JIS-C5102-1977 8.5) executed for 5 seconds at a temperature of 260 deg.C. |
