| 摘要 |
PURPOSE:To provide a manufacture of a semiconductor device for fixing the thickness of solder lying between a semiconductor pellet and heat sink. CONSTITUTION:A head sink 2 is heated by a heater 4, a fixed quantity of cylindrical solder 21 mixed with non-metallic particles 20 such as alumina or silica is then supplied from a solder feeder 5 onto the heated heat sink 2 by feed rollers 12, 13 and molten; a semiconductor pellet 1 adsorbed to a collet 7 is supplied onto a molten solder 3a after the molten solder 3a is scattered, the pellet is subsequently scrubbed and stuck fast to the heat sink 2, and scrubbed and thereafter cooled so that the semiconductor pellet 1 is mounted on the heat sink 2. |
