发明名称 Gehäuse zur Umhüllung eines zerbrechlichen Elementes, wie einer logischen Schaltung und Verfahren zur Montage eines derartigen Gehäuses.
摘要 Housing intended to enclose in particular a logic circuit (15) including two shells (11a, 11b) each including a weld zone (17a, 17b) of geometry suitable to permit ultrasonic welding, and such that when the two shells are assembled before the welding operation, they are offset along a vertical axis (20). The support (13) includes a mounting ear (23) whereas the shells include a seating (33a, 33b). During the welding operation, no concomitant contact exists between each one of the upper (26) and lower (27) faces of the ear (23) and the corresponding bearing faces (34a, 34b) of the seatings, thanks to the offset (21). This offset lessens and the concomitant contact is brought about between the bearing faces (34a, 34b) of the seatings and each of the upper and lower faces (26, 27) of the ear (23) only at the end of the welding operation. <IMAGE>
申请公布号 DE68909060(T2) 申请公布日期 1994.04.28
申请号 DE1989609060T 申请日期 1989.01.09
申请人 SGS-THOMSON MICROELECTRONICS S.A., GENTILLY, FR 发明人 STEFFEN, FRANCIS, F-73100 AIX LES BAINS, FR
分类号 B65D85/57;B29C65/08;B42D15/10;G06K19/077;G09F1/10;H01L21/50;H05K5/00 主分类号 B65D85/57
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