PRODUCTION OF MULTILAYER PRINTED WIRING BOARD

摘要

PURPOSE:To obtain a multilayer printed wiring board excellent in adhesion and haloing resistance by carrying out conventional production steps as it is without reducing copper oxide film and treating the board with a stabilizing liquid after it is drilled. CONSTITUTION:An inner layer board where copper oxide is formed selectively on the surface of a circuit pattern, a bonding sheet, and an outer layer metal foil are laminated integrally to form a multilayer printed board. The board is then drilled and subjected to surface treatment with a treating solution containing 5-50g/l of thiourea thus producing a multilayer printed wiring board.